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| 영진코퍼레이션 종합카다로그 |
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| Used for IC chip bonding. It consists of silver particles and a binder. Because the ratio of silver is high, redispersion is necessary before use. |
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| Material |
Silver paste |
| Capacity |
20 g |
| Unit |
THINKY MIXER ARV-310 |
| Operation time setting |
2000rpm 30sec |
| Compounding ratio |
60wt％ |
| Material Viscosity |
150 Pas |
| Specific gravity |
2.5 |
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| Before |
After |
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| THINKY MIXER (vacuum) ARV-310P |
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